ESiP awarded ENIAC Innovation Award

The Efficient Silicon Multi-Chip System-in-Package Integration (ESiP) project has been awarded the ENIAC Innovation Award 2013. It is the largest European project on the large scale integration and miniaturisation of microelectronic systems.

The research focused on improving the reliability, failure analysis, and testing of highly integrated microelectronics components. The scheme’s 40 partners – including microelectronics companies and research institutions – from nine European countries have made it possible to make system-in-package (SiP) solutions more reliable.

Increasing miniaturisation and functional diversity has become a global trend in microelectronics. To achieve higher system integration, SiP technology is vitally important. SiP ensures different types of chips of different production technologies and linewidths are installed side by side or one above the other and work smoothly. SiP components are used in several areas, including communication and computer technology, energy production and distribution, vehicle electronics, medicine, and LED lighting.

The ENIAC joint undertaking is a public private partnership in nanoelectronics, bringing together ENIAC member states, the EU and AENEAS (an industry association of European research and development organisations).